
TI was an early leader in the development of high-volume copper wire bonding in our packaging for analog, embedded processing and wireless products. Since 2008, TI has shipped nearly 6.5 billion copper wire bonding units, and it is delivering important performance, reliability, quality and cost advantages to customers. Read more about our history with this technology in our latest white paper: http://ow.ly/b5ZA5
TI's journey to high-volume copper wire bonding production
ow.ly

Bastienlemasson : RT @ChuckyNorris_fr: Quand il était au lycée, Chuck Norris utilisait une calculatrice Walker Texas Instruments. - 4 hours ago
Elmehdi B. : RT @ChuckyNorris_fr: Quand il était au lycée, Chuck Norris utilisait une calculatrice Walker Texas Instruments. - 4 hours ago
Myrna Demos : office furniture distributors : Texas Instruments TI1795SV Solar Calculator... http://t.co/wG31Good - 1 day ago